|
[1] V. Ganapathi, C. Plagemann, D. Koller, and S. Thrun, “Real Time Motion Capture Using a Single Time-of-Flight Camera,” IEEE Computer Society Conference on Computer Vision and Pattern Recognition, 2010. [2] M. Van den Bergh and L. Van Gool, “Combining RGB and ToF Cameras for Real-Time 3D Hand Gesture Interaction,” IEEE Workshop on Applications of Computer Vision, 2011. [3] P. J. Besl, “Active, Optical Range Imaging Sensors,” Machine Vision and Applications, vol. 1, pp. 127-152, 1988. [4] R. G. Dorsch, G. Hausler, and J. M. Herrmann, “Laser Triangulation: Fundamental Uncertainty in Distance Measurement,” Applied Optics, vol. 33, pp. 1306-1314, 1994. [5] J. Ohta, “Smart CMOS Image Sensors and Applications,” CRC Press, 2007 [6] J. Nakamura, “Image Sensors and Signal Processing for Digital Still Cameras,” CRC Press, 2005 [7] L. Yao, “CMOS Readout Circuit Design for Infrared Image Sensors,” proceedings of the SPIE, International Symposium on Photoelectronic Detection and Imaging, vol. 7384, 2009. [8] A. W. Hoffman, “Capacitor Transimpedance Amplifier ( CTIA) with Shared Load,” US patent 6,252,462, 2001. [9] R. Lange, “3D Time-of-Flight Distance Measurement with Custom Solid-State Image Sensors in CMOS/CCD-Technology,” 2000. [10] M. Abdelhamid, J. Beers, and M. Omar, “Extracting Depth Information Using a Correlation Matching Algorithm,” Journal of Software Engineering and Applications, vol. 5, 2012. [11] S. Koyama, K. Onozawa, K. Tanaka, and Y. Kato, “A 3D vision 2.1Mpixel image sensor for single-lens camera systems,” IEEE International Solid-State Circuits Conference, Digest of Technical Papers, 2013. [12] Y. Oike, M. Ikeda, and K. Asada, “A 120×110 Position Sensor With the Capability of Sensitive and Selective Light Detection in Wide Dynamic Range for Robust Active Range Finding,” IEEE Journal of Solid-State Circuits, vol. 39, no. 1, pp. 246-251, 2004. [13] L. Gasparini, M. Zarghami, H. Xu, L. Parmesan, M. Moreno Garcia, M. Unternährer, B. Bessire, A. Stefanov, D. Stoppa, and M. Perenzoni, “A 32×32-pixel time-resolved single-photon image sensor with 44.64μm pitch and 19.48% fill-factor with on-chip row/frame skipping features reaching 800kHz observation rate for quantum physics applications,” IEEE International Solid-State Circuits Conference, 2018. [14] C. Niclass, A. Rochas, P.-A. Besse, and E. Charbon, “Design and characterization of a CMOS 3-D image sensor based on single photon avalanche diodes,” IEEE Journal of Solid-State Circuits, vol. 40, no. 9, pp. 1847-1854, 2005. [15] C. Niclass, C. Favi, T. Kluter, M. Gersbach, and E. Charbon, “A 128×128 Single-Photon Imager with on-Chip Column-Level 10b Time-to-Digital Converter Array Capable of 97ps Resolution,” IEEE International Solid-State Circuits Conference, Digest of Technical Papers, 2008. [16] C. Niclass, M. Soga, H. Matsubara, M. Ogawa, and M. Kagami, “A 0.18-μm CMOS SoC for a 100-m-Range 10-Frame/s 200×96-Pixel Time-of-Flight Depth Sensor,” IEEE Journal of Solid-State Circuits, vol. 49, no. 1, pp. 315-330, 2014. [17] A. R. Ximenes, P. Padmanabhan, M.-J. Lee, Y. Yamashita, D. N. Yaung, and E. Charbon, “A 256×256 45/65nm 3D-Stacked SPAD-Based Direct TOF Image Sensor for LiDAR Applications with Optical Polar Modulation for up to 18.6dB Interference Suppression,” IEEE International Solid-State Circuits Conference, 2018. [18] A. M. Pawlikowska, A. Halimi, R. A. Lamb, and G. S. Buller, “Single-Photon Three-Dimensional Imaging at up to 10 Kilometers Range,” Optics Express, vol. 25, no. 10, pp. 11919-11931, 2017. [19] D. Stoppa, N. Massari, L. Pancheri, M. Malfatti, M. Perenzoni, and L. Gonzo, “A Range Image Sensor Based on 10-μm Lock-In Pixels in 0.18-μm CMOS Imaging Technology,” IEEE Journal of Solid-State Circuits, vol. 46, no. 1, pp. 248-258, 2011. [20] S.-M. Han, T. Takasawa, T. Akahori, K. Yasutomi, K. Kagawa, and S. Kawahito, “A 413×240-Pixel Sub-Centimeter Resolution Time-of-Flight CMOS Image Sensor with In-Pixel Background Canceling Using Lateral-Electric-Field Charge Modulators,” IEEE International Solid-State Circuits Conference, Digest of Technical Papers, 2014. [21] J. Cho, J. Choi, S.-J. Kim, S. Park, J. Shin, J. D. K. Kim, and E. Yoon “A 3-D Camera with Adaptable Background Light Suppression Using Pixel-Binning and Super-Resolution,” IEEE Journal of Solid-State Circuits, vol. 49, no. 10, pp. 2319-2332, 2014. [22] C. S. Bamji, S. Mehta, B. Thompson, T. Elkhatib, S. Wurster, O. Akkaya, A. Payne, J. Godbaz, M. Fenton, V. Rajasekaran, L. Prather, S. Nagaraja, V. Mogallapu, D. Snow, R. McCauley, M. Mukadam, I. Agi, S. McCarthy, Z. Xu, T. Perry, W. Qian, V.-H. Chan, P. Adepu, G. Ali, M. Ahmed, A. Mukherjee, S. Nayak, D. Gampell, S. Acharya, L. Kordus, and P. O'Connor, “1Mpixel 65nm BSI 320MHz Demodulated TOF Image Sensor with 3.5μm Global Shutter Pixels and Analog Binning,” IEEE International Solid-State Circuits Conference, 2018. [23] J, Cho, “CMOS Sensors for Time-Resolved Active Imaging,” 2017. [24] T. Oggier, R. Kaufmann, M. Lehmann, B. Büttgen, S. Neukom, M. Richter, M. Schweizer, P. Metzler, F. Lustenberger, and N. Blanc, “Novel Pixel Architecture with Inherent Background Suppression for 3D Time-of-Flight Imaging,” Proceedings SPIE, vol. 5665, pp.1-8, 2005. [25] M. Lehmann, T. Oggier, B. Büttgen, Chr. Gimkiewicz, M. Schweizer, R. Kaufmann, F. Lustenberger, and N. Blanc, “Smart Pixels for Future 3D-TOF Sensors,” IEEE Workshop on CCDs and Advanced Image Sensors, 2005. [26] B. Büttgen, T. Oggier, M. Lehmann, R. Kaufmann, S. Neukom, M. Richter, M. Schweizer, D. Beyeler, R. Cook, C. Gimkiewicz, C. Urban, P. Metzler, P. Seitz, and F. Lustenberger, “High-Speed and High-Sensitive Demodulation Pixel for 3D Imaging,” Proceedings SPIE, vol. 6056, pp.22-33, 2006. [27] B. Büttgen and P. Seitz, “Robust Optical Time-of-Flight Range Imaging Based on Smart Pixel Structures,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 55, no. 6, 2008. [28] M. Perenzoni, N. Massari, D. Stoppa, L. Pancheri, M. Malfatti, and L. Gonzo, “A 160×120-Pixels Range Camera with In-Pixel Correlated Double Sampling and Fixed-Pattern Noise Correction,” IEEE Journal of Solid-State Circuits, vol. 46, no. 7, pp. 1672-1681, 2011. [29] M. Davidovic, M. Hofbauer, K. Schneider-Hornstein, and H. Zimmermann, “High Dynamic Range Background Light Suppression for a TOF Distance Measurement Sensor in 180nm CMOS,” IEEE Sensors, pp. 359-362, 2011. [30] M. Davidovic, M. Hofbauer, and H. Zimmermann, “A 33 × 25 µm² Low-Power Range Finder,” IEEE International Symposium on Circuits and Systems, 2012. [31] C. Anand, V. K. Jacob, and M. Sarkar, “A Current Mode Time-of-Flight Pixel with 400 klx Background Light Subtraction,” IEEE International Midwest Symposium on Circuits and Systems, 2016. [32] T. Liao, N.-A. Lee, and C.-C. Hsieh, “A CMOS Time of Flight (TOF) Depth Image Sensor with In-Pixel Background Cancellation and Sensitivity Improvement Using Phase Shifting Readout Technique,” IEEE Asian Solid-State Circuits Conference, 2017. [33] T.-H. Hsu, T. Liao, N.-A. Lee, and C.-C. Hsieh, “A CMOS Time-of-Flight Depth Image Sensor With In-Pixel Background Light Cancellation and Phase Shifting Readout Technique,” IEEE Journal of Solid-State Circuits, vol. 53, no. 10, pp. 2898-2905, 2018. [34] D. A. Kerth, “Switched-capacitor integrator with chopper stabilization performed at the sampling rate,” U.S. Patent 5,477,481, Dec. 1995. [35] C. C. Enz and G. C. Temes, “Circuit Techniques for Reducing the Effects of Op-amp Imperfections: Autozeroing, Correlated Double Sampling, and Chopper Stabilization,” Proceedings of the IEEE, vol. 84, no. 11, pp. 1584-1614, 1996. [36] J. F. Witte, K. A. A. Makinwa, and J. H. Huijsing, “A CMOS Chopper Offset-Stabilized Opamp,” IEEE Journal of Solid-State Circuits, vol. 42, no. 7, pp. 1529-1535, 2007. [37] H. M. Jafari and R. Genov, “Chopper-Stabilized Bidirectional Current Acquisition Circuits for Electrochemical Amperometric Biosensors,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 60, no. 5, pp. 1149-1157, 2013. [38] Q. Fan, K. A. A. Makinwa, and J. H. Huijsing, “Capacitively-Coupled Chopper Amplifiers,” Analog Circuits and Signal Processing, Springer, 2017. [39] W.-F. Chou, S.-F. Yeh, and C.-C. Hsieh, “A 143dB 1.96% FPN Linear-Logarithmic CMOS Image Sensor with Threshold-Voltage Cancellation and Tunable Linear Range,” IEEE Sensors, 2012. |