本論文提出以近紅外光燒結凹版轉印高黏度微米銀漿顆粒，使其構成的金屬網格表面粗糙度及導電性得以改善。燒結後近乎零孔隙率的金屬網格顯示本研究所開發之燒結方法具有實際效益。實驗結果顯示，經近紅外光燒結後，金屬網格表面粗糙度改善60.5%，銀比例提升18.5%；比起傳統烘箱燒結，此兩特性分別優化2.69%及1.37%。除此之外，能量色散X-射線光譜及拉曼光譜分析結果顯示此燒結方法有助於抑制非導電化合物形成化學鍵結，致使表面粗糙度及片電阻值分別改善90.9%及98.6%。近紅外光對燒結金屬網格改善表面粗糙度及增進導電性有實際效益，再加上其支援卷對卷的優點，更使得近紅外光燒結技術比起傳統烘箱燒結實際適合應用於連續式的有機發光二極體生產製程。

This work proposes a near-infrared (NIR) sintering method to improve the surface roughness and enhance the sheet resistance of a gravure-offset-printed metal mesh with viscous silver paste that contains large nanoparticles. Results indicate that the sintering was thorough because the porosity in the metal mesh approached zero percent. Examination proved a 60.5% surface roughness improvement and a 18.5% increment of Ag content in the metal mesh after NIR sintering, indicating respectively 2.69% and 1.37% improvement compared with conventional oven operations. In addition, material analyses through both energy-dispersive and Raman spectroscopy explained the reduction of insulative elements and features with chemical bonds in the metal mesh, supporting the finding of overall respective improvements in surface roughness (90.9%) and sheet resistance (98.6%). The effective NIR sintering evaluated in the present work was proven to be not only capable of replacing discontinuous oven operations in roll-to-roll manufacturing but also efficient in enhancing the material characteristics under identical sintering conditions compared with conventional oven operations.

目錄
摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VIII
表目錄 XI
符號表 XII
第1章 緒論 1
1.1.前言 1
1.1.1.凹版印刷技術應用於製造非軟性電子之挑戰 1
1.1.2.金屬網格之特性與用途 2
1.1.3.導電銀漿油墨的燒結原理 3
1.1.4.電性及光學表現評估 5
1.2.研究動機 6
1.3.文獻回顧 7
1.3.1.非支援卷對卷之燒結技術 7
1.3.1.1.微波燒結 7
1.3.1.2.雷射燒結 8
1.3.1.3.電漿燒結 8
1.3.2.支援卷對卷之燒結技術 9
1.3.2.1.近紅外光(Near Infrared, NIR)燒結 9
1.3.2.3.快速熱退火(Rapid Thermal Annealing, RTA)燒結 10
1.3.3.燒結效益的量化及評比 10
第2章 理論與設計 12
2.1.實驗進行之導向 12
2.1.1.金屬顆粒大小與燒結溫度之關係 12
2.1.2.支援卷對卷之燒結方法 13
2.2.結果測量之導向 13
2.2.1.計算優值(Figure of Merit, FOM)評估效益 13
2.2.2.元素組成分析 14
第3章 實驗製程方法 15
3.1.實驗流程 15
3.2.實驗製程與設備 16
3.2.1.燒結設備 16
3.2.1.1.烘箱系統(Oven System) 16
3.2.1.2.近紅外光系統(NIR System) 17
3.2.1.3.快速熱退火系統(RTA System) 18
3.2.2.測量和分析設備 18
3.2.2.1.四點探針(Four Points Probe) 18
3.2.2.2.場發射槍掃描式電子顯微鏡與能量色散X-Ray光譜 19
3.2.2.3.聚焦離子束掃描式顯微系統(FIB-SEM)與影像分析 21
3.2.2.4.表面輪廓儀(Stylus Profiler) 22
3.2.2.5.光譜儀(Spectrometer) 23
3.2.2.6.拉曼光譜儀(Raman Spectroscopy) 24
第4章 結果與討論 25
4.1.表面粗糙度與片電阻值 25
4.2.結構與孔隙率 27
4.3.元素組成 28
4.4.FOM分析 30
4.5.田口實驗設計之驗證 31
第5章 結論 33
第6章 未來工作 35
參考文獻 89
發表清單 94

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