目前薄膜電晶體液晶面板技術已趨成熟，然而因其高功耗之缺點，應用於可攜式消費性電子產品會降低電池續航力。因此開發低功耗顯示器技術成為趨勢，而微型發光二極體陣列顯示器具有低功耗、高亮度、尺寸輕薄等優勢，具有極大的潛力應用於可攜式電子產品，但全彩的微型發光二極體陣列面板需要將大量的三原色微型發光二極體分次組裝於面板上，需發展批量轉移晶片之技術以解決組裝效率問題使該面板技術得以商品化。
本研究利用微機電技術開發靜電式轉移頭，期望利用電路控制轉移頭產生靜電力以達到抓取、放置微型發光二極體之功能。所設計之靜電式轉移頭利用矽具有良好導電特性以及機械性質，製作靜電電極、接觸凸塊、緩衝彈簧結構等。其中以靜電電極與彈簧結構為設計重點，採用靜電式抓取使本研究提出之轉移頭同時具有批量轉移與選擇性轉移晶片的功能，且彈簧結構可以緩衝轉移時機台預壓之壓力以及提供晶片放置之垂直作用力。

Recently, thin film transistor liquid crystal technology has matured. But because of its high power consμmption of the shortcomings, used in portable consμmer electronics products will reduce battery life. Therefore, the development of low power consμmption display technology has become a recent trend. Micro light emitting diode array display with low power consμmption, high brightness, light, and other advantages, has potential for portable electronic products. However, commercialize full-color display encounter difficulty of batch chip assemble, it needs developing batch transfer technology of micro-chip to solve the problem.
In this study, electrostatic transfer heads was developed by using MEMS technique. Electrostatic force can be generated by controlling the transfer head to pick and place micro light emitting diodes. The design of micro electrostatic transfer heads uses silicon as material with well conductance and mechanical properties. Design includes electrostatic electrodes, contact bump, buffer spring structure. Electrostatic electrode and spring structure are the design focus. The using of electrostatic force makes transfer head have functions of batch transferring and selective transferring the chips. The spring structure can buffer the pressure of the machine preload and to provide vertical force for chip placement.

中文摘要 I
Abstract II
誌謝 III
目錄 IV
圖目錄 VI
表目錄 XI
第一章 緒論 1
1.1 前言 1
1.2 文獻回顧 4
1.2.1 晶片轉移 5
1.2.2 轉移機制 5
1.2.3 靜電吸盤之應用 8
1.3 研究動機 10
第二章 設計與分析 20
2.1 系統架構 20
2.2 設計考量 23
2.3 靜電電極設計 25
2.3.1 靜電力抓取原理 25
2.3.2 電極配置設計 25
2.3.3 介電層設計 26
2.3.4 凸塊設計 27
2.4 彈簧設計 27
2.5 轉移頭設計 29
第三章 元件製程 40
3.1 製作流程 40
3.2 製程問題與改善 43
3.3 製程結果與討論 45
第四章 量測與結果 56
4.1 轉移模組裝配 56
4.2 功能驗證 57
4.2.1 轉移功能驗證 57
4.2.2 靜電力量測 59
4.2.3 整合於自動化定位平台 63
第五章 結論與未來工作 73
5.1 結論 73
5.2 未來工作 74
參考文獻 77

[1] https://www.i-micronews.com/
[2] http://www.maxi-pedia.com/tft+lcd+display+monitor+panel
[3] C.-C. Chen, C.-Y. Wu, and T.-F. Wu,“LED back-light driving system for LCD panels,” Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, Dallas, TX, March, 2006, pp381-385.
[4] http://technews.tw/2016/09/22/micro-led-ledinside-forμm-2016
[5] A. Bibl, J.A. Higginson, H. -f. S. Law, H. -H. Hu, U.S. Patent NO.20130126827 A1, 2013.
[6] S. X. Jin, J. Li, J. Z. Li, J. Y. Lin, and H.X. Jiang, “GaN microdisk light emitting diodes,” Applied Physics Letters, VOL. 76, pp631-633, 2000
[7] H.X. Jiang, S.X. Jin, J. Lin, and J. Sakya, and J. Y. Lin, “III-nitride blue microdisplay,” Applied Physics Letters, VOL. 78, pp1303-1305, 2001.
[8] S.-I. Park, Y. Xiong, R.H. Kim, P. Elvikis, M. Meitl, D.H. Kom, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J.A. Rogers,“Printed assemblies of inorganic light-emitting diode for deformable and semitransparent displays,” Science, VOL .35, pp977-981, 2009.
[9] http://www.sony.net/SonyInfo/News/Press/201201/12-005E/
[10] http://www.ledinside.com.tw/research/20160804-32880.html
[11] C.-H. Chu1, W.-P. Shih, S.-Y. Chung, H.-C. Tsai, T.-K. Shing and P.-Z. Chang, “A low actuation voltage electrostatic actuator for RF MEMS switch applications,” Journal of Micromechanics and Microengineering, VOL.7, pp 1649-1656, 2007.
[12] A. Muller, J. Gottert and J. Mohr,“LIGA microstructures on top of micromachined silicon wafers used to fabricate a micro-optical switch,” Journal of Micromechanics and Microengineering, VOL.3, pp158-160, 1993.
[13] J. Singh, J.H.S. Teo, Y. Xu, C.S. Premachandran, N. Chen, R. Kotlanka, M. Olivo, and C. J. R. Sheppard, “A two axes scanning SOI MEMS micromirror for endoscopic bioimaging,” Journal of Micromechanics and Microengineering, VOL .18, 2008.
[14] http://www.ti.com/lsds/tw/homepage.page
[15] http://www.micro-mechanics.com
[16] P. Kim, Y.-D. Ha, H. Park, and J.-H. Park, “development of die-bonder with multi & matrix picker and placer to increase production capacity,” Proceedings of the World Congress on Engineering and Computer Science, San Francisco, CA, October, 2012.
[17] R. Guerre, U. Drechsler, D. Jubin, and M. Despont, “Selective Transfer Technology for Microdevice Distribution,” Journal Of Microelectromechanical Systems, VOL. 17, pp157-165, February ,2008
[18] A. Carlson, A.M. Bowen, Y. Huang, R.G. Nuzzo, and J.A. Rogers,“transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Advanced materials, VOL.24, pp 5284-5318, 2012.
[19] C. A. Bower, M.A. Meitl, and S. Bonafede, “Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing,” IEEE Electronic Components and Technology Conference (ECTC), San Diego, USA , pp963-967, May, 2015.
[20] Y.-C. Wu, “Development of Micro Pick-up Array for Micro LED Assembly, ” NTHU, MS, Thesis, 2016
[21] A. Bibl, J.A. Higginson, H.-f S. Law and H.-H. Hu, U.S. Patent NO.8789573 B2, 2014.
[22] A. Bibl, and D. Golda, US Patent NO. 8,791,530, 2014.
[23] https://en.wikipedia.org/wiki/Defective_pixel
[24] https://www.aerotech.com
[25] http://www.oxfordplasma.de/technols/e_chuck.htm
[26] J. F. Daviet, L. Peccoud, and F. Mondon, “Electrostatic Clamping Applied to Semiconductor Plasma Processing,” Journal of the Electrochemical, VOL. 140, pp3245-3256, 1993
[27] T. Fukushima, H. Hashiguchi, J. Bea1, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi, “3D Integration Technologies Using Self-Assembly and Electrostatic Temporary Multichip Bonding,” IEEE Electronic Components & Technology Conference, Las Vegas, US, May, 2013.
[28] C. Landesberger, R. Wieland, A. Klμmpp, P. Ramm, A. Drost, U. Schaber, D. Bonfert, and K. Bock,“Electrostatic wafer handling for thin wafer processing,” IEEE The European Microelectronics and Packaging Conference & Exhibition, Rimini, Italy, June, 2009.
[29] https://en.wikipedia.org/wiki/Dots_per_inch
[30] https://www.azom.com/properties.aspx?ArticleID=1114
[31] https://www.azom.com/properties.aspx?ArticleID=53
[32] https://www.azom.com/properties.aspx?ArticleID=52
[33] K. Petersen, “Silicon as a Mechanical Material,” Proceedings of The IEEE, VOL.70, pp420-457,1982.
[34] J. Karttunen, J. Kiihamäki, S. Franssila, “Loading effects in deep silicon etching,” Proceedings of the SPIE, VOL4174, pp90-97,2000.
[35] B. Koo, P. Ferreira, “An active MEMS probe for fine position and force measurements,” Precision Engineering, VOL.38, pp738-748, 2014.
[36] M. Jenke, C. Santschi, P. Hoffmann, “Two-dimensional electrostatic force field measurements with simultaneous topography measurement on embedded interdigitated nanoelectrodes using a force distance curve based method,” Applied Physics Letters, VOL.92, 2008.