近年來處理器晶片的效能不斷提高，同時也帶來了大量的熱，要如何將這些熱傳導至晶片另一面以提升散熱效果將會是本研究的重點。本研究將使用模擬的方式，來探討熱通孔以及地極銅層在晶片熱擴散上的影響，並改變熱通孔的數量、地極銅層的合併與為合併、地極銅層的厚度。在本研究使用的晶片上，可以看到熱通孔的數量改變至原本的60%時，最高溫度幾乎無變化；地極銅層的合併能增進晶片內部的橫向擴散；地極銅層的厚度增加至原本的2倍時最高溫度可以下降約10℃。所以相對於原始晶片的配置，減少熱通孔數量、合併地極銅層以及增加地極銅層厚度，將會是此晶片的最佳散熱配置。

關鍵字：晶片、熱通孔、地極銅層、熱傳導

Recently, the performance of chips increases with great heat dissipation. How to resolve this heat dissipation by transfer to the other side of chip will be investigated in this study. This work uses numerical simulation to study thermal via and ground plan’s arrangement by altering thermal via number, ground plan separated/merged, ground plan’s thickness. Compared to original chip design, reducing 40% thermal via number affects the maximum temperature slightly; merged ground plan can improve horizontal heat transfer; increasing ground plan’s thickness can reduce approximately 10℃ of maximum temperature. Compared with original chip design, reducing thermal via number, merging ground plan and increasing ground plan’s thickness is the best solution.

Keyword: chip, thermal via, ground plan, heat transfer

目錄
摘要 I
致謝 II
目錄 III
圖表目錄 V
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 2
1.3 文獻回顧 4
第二章 基礎理論與熱通孔、地極銅層介紹 11
2.1 熱阻理論分析 11
2.2 熱通孔與地極銅層介紹 11
2.3 熱通孔熱阻分析 18
第三章 模擬設定 21
3.1模擬軟體介紹 21
3.2 模擬環境設定與物件設定 21
3.2.1 環境設定 21
3.2.2模擬物件設定 25
3.2.3模擬網格設定 30
第四章 模擬結果 33
4.1 模擬的晶片方案 33
4.2 模擬結果 - 地極銅層與熱通孔的組合 34
4.3 模擬結果 - 地極銅層的厚度變化 55
第五章 結論 64
參考文獻 66

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