本實驗利用無壓真空液相燒結製程製備高導熱銅基鑽石複合材料，進一步對其接合面進行適當整平處理後與常用的電路基板接合。透過選用不同銅粉粉末、活性元素鋯添加量與冷壓製程參數的調整，優化複合材料的熱傳導係數，最高可達716 W/mK。此複材以市售的兩種熱界面材料與氮化鋁、矽、氧化鋁基板做接合。軟焊焊料於接合時，無法有效導熱；液態金屬則於接合應用表現優秀，最佳的接合系統，矽基板模組平均熱傳導係數可達322 W/mK，且經1000次低溫或5次高溫熱循環後，仍能維持75 %以上熱傳導值。
由界面處的成份與結構分析探討模組熱循環劣化原因，透過減低熱界面材料鎵金屬含量及提高其熔點進行改善，選用四種液化線為100 C的不同比例鎵、銦及錫三元合金熱界面材料進行接合；以Ga15In75Sn10合金表現最優異，矽基板模組可達377 W/mK、氮化鋁基板可達365 W/mK；相較於市售液態金屬接合模組提升熱傳導值55-66 W/mK，且在1000次低溫熱循環後仍有90%以上熱傳導值，5次高溫熱循環後仍有98%以上熱傳導值；顯示此一熱界面材料性能優於市售液態金屬，極具有商業潛力。

Diamond/Cu composites for the use of heat spreader were fabricated via pressureless liquid phase sintering process. Further leveling treatments were applied to these composites, in order to obtain a smooth surface for the following electronic package bonding process. Through the selection of different Cu powder, amount of active Zr element added to composites and parameters of cold pressing, a high thermal conductivity of 716 W/mK composite could be made. The surface roughness was reduced from 35 μm to 1.6 μm by attaching a Cu/Zr flake to the composites before sintering, which reached the joining required smoothness. AlN, Si, and Al2O3 sheets were chosen as substrates and joined with composites by commercial lead-free solder paste and liquid metal. Liquid metal joined packages had great performance opposite to the solder pasted ones with a thermal conductivity of 322 W/mK in the couple of Si substrate, and showed good reliability with above 75% residue thermal conductivity after lower or higher temperature thermal cycle tests.
After analyzing the interface of the packages, four higher melting point Ga-In-Sn TIM alloys were designed. Packages joined by Ga15In75Sn10 TIM had the best performance, even better than the liquid metal joined ones, with a Si joined package reaching the best thermal conductivity of 377 W/mK. Moreover, 90% of thermal conductivity remained after low temperature thermal cycle test, 98% remained after high temperature thermal cycle test. These results showed this new TIM had excellent performance and great commercial potential.

摘要 I
Abstract II
致謝 III
目錄 VIII
圖目錄 XIII
表目錄 XXII
壹、 前言 1
貳、 文獻回顧 3
2.1 散熱材料的重要性 3
2.2 散熱材料的發展 5
2.2.1 傳統散熱材 6
2.2.2 先進散熱材料 8
2.3 鑽石金屬基複合材材料 11
2.3.1 常見製程 11
2.3.2 理論性質 16
2.4 影響金屬基鑽石複材熱性質的因素 22
2.4.1 鑽石與金屬基材的界面潤濕問題 22
2.4.2 鑽石粒徑與體積分率 24
2.4.3 界面層厚度 25
2.4.4 鑽石晶面差異 27
2.5 熱循環測試 29
2.5.1 熱循環測試之目的及原理 29
2.5.2 熱循環測試的規範 30
2.6 熱界面材料 32
2.6.1 熱界面材料熱阻 32
2.6.2 熱界面材料的分類與特性 38
2.6.3 熱界面材料相關文獻研究成果 40
2.7 電子封裝 44
2.7.1 電子封裝層級 45
2.7.2 常見電路基板 47
參、 實驗方法與步驟 49
3.1 實驗設計與流程 49
3.1.1 成分來源及其性質 49
3.1.2 實驗設計與原理 52
3.1.3 實驗規劃 55
3.1.4 實驗參數 58
3.2 乾式混粉與冷壓成型 59
3.3 水平爐管真空液相燒結 59
3.4 複合材料與接合封裝的性質與分析 62
3.4.1 微結構觀察 62
3.4.2 緻密度量測 63
3.4.3 熱傳導係數量測 64
3.4.4 熔點量測 65
3.4.5 表面粗糙度量測 65
3.4.6 基板接合 66
3.4.7 熱循環測試 67
肆、 結果與討論 71
4.1 乾式混粉前粉末觀察 71
4.2 接合前複材性質 74
4.2.1 不同銅粉形貌對複材熱性質影響 74
4.2.2 活性元素添加量對複材熱性質影響 77
4.2.3 不同壓胚壓力對複材熱性質影響 84
4.3 基板性質 88
4.3.1 熱傳導係數 88
4.3.2 表面粗糙度 89
4.4 表面處理 91
4.4.1 銅鋯薄片添加 93
4.4.2 鋼片加壓整平 96
4.4.3 銅鋯薄片與鋼片加壓整平 101
4.4.4 整平後熱傳導係數量測數值修正 103
4.5 無鉛錫膏接合模組 106
4.6 液態金屬接合模組 110
4.6.1 液態金屬性質分析 110
4.6.2 液態金屬接合模組熱性質分析 112
4.6.3 液態金屬接合模組接合界面分析 119
4.7 低熔點合金接合模組 139
4.7.1 低熔點合金配製 139
4.7.2 低熔點合金性質分析 142
4.7.3 低熔點合金接合模組熱性質分析 155
4.7.4 低熔點合金接合模組接合界面分析 162
4.8 銅片接合模組分析 169
伍、 結論 172
陸、 建議未來研究方向 175
柒、 參考文獻 176

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