列印技術在近代資訊與知識的傳播以及發展上佔了非常重大的一部分，而隨著科技的發展，人們也發展出非常多種類的列印技術，其中熱傳導式列印更是被廣泛應用在日常生活中，不論是使用熱感應紙的發票，還是使用熱傳到列印中的熱昇華技術的相片列印，都給了我們非常大的便利。

熱傳導式列印技術技術源自於1987年，日本的科學家利用半導體技術做出高解析度的熱傳導式列印加熱頭，這種列印頭有著產能高、不易損壞等好處，本實驗的重點在於熱傳導式列印加熱頭的製作。

在熱列印頭當中，最重要的部分就是加熱電阻，此加熱層需要3000 $\Omega$的片電阻值，厚度要在35到50 nm之間。由於氧化鉭矽有著高熱阻抗性，不易在高溫中改變其性質且是一種高電阻率材料，所以我們選用氧化鉭矽作為加熱電阻的材料。本實驗使用射頻濺鍍系統，嘗試轟擊氧化鉭矽與矽化鉭把材，利用濺鍍的方式濺鍍氧化鉭矽薄膜作為加熱電阻，探討各參數對薄膜電阻值的關係，最後成功濺鍍出符合目標電阻率的薄膜，並且運用在熱列印頭元件上。

Printing technology has played a great role in propagation and
development of modern knowledge and information. With the progress
of technology, people developed various kinds of printing technology.
Especially for thermal transfer printing which is widely used
in daily life. For example, the invoice we received is printed by using
heat-sensitive paper, and the photo printing by sublimation is
one of applications of thermal transfer printing. These technology
has given us great convenience in life.
Heat transfer printing technology was introduced since 1987.
The Japanese scientists used semiconductor processing technology
to make high-resolution heat transfer printing head. This printing
head has advantages like high productivity, non-vulnerable to
physical damage. In this thesis, we will put emphasis on the production
of Thermal transfer printing head.
In the Thermal print head, the most important part is heating
resistor. The sheet resistance of this heating layer is required to be
3000 Ω. The thickness of the heating resistor is bonded within 35
II
to 50 nm. Tantalum silicon oxide is highly thermal resistive, nonvulnerable
to high temperature and high resistivity material. Thus,
tantalum silicon oxide is used as the material of heating resistor.
In this experiment, we use RF sputtering system to bombard the
tantalum silicon oxide and tantalum tungsten Target, fabricate the
heating resistor by using RF sputtering to deposit tantalum silicon
oxide film, discuss the relationship between RF sputtering parameters
and the film resistance, and successfully deposit heating resistor
which is required. Eventually, We use the heating resistor in
the thermal print head device.

論文摘要 I
abstract II
目 錄 V
第一章 序論 1
1.1 列印技術的分類 2
1.1.1 模板印刷 2
1.1.2 無模板印刷 4
1.2 熱列印技術
1.2.1 直接熱列印 7
1.2.2 熱傳導式列印 8
1.2.3 熱列印頭 9
1.2.4 熱昇華列印 12
1.2.5 熱列印頭製作 14
第二章 實驗計畫與方法介紹 15
2.1 實驗計畫 16
2.2 直交原則與直交表 16
2.3 田口分析 18
第三章 實驗設計與實驗介紹 20
3.1 實驗儀器介紹 21
3.1.1 射頻濺鍍系統 21
3.1.2 四點探針 23
3.1.3 掃描式電子顯微鏡（SEM）與能量散布分析儀（EDS） 23
3.1.4 X光繞射儀 24
第四章 結果與討論 25
第五章 結論與未來展望 32
參考文獻 34

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