面對與日俱增的半導體競爭市場，企業無不追求成本控制與良率提升，在半導體製程當中，IC載板扮演了相當重要的角色，在晶圓封裝前，透過晶圓探針卡之探頭與晶圓接觸以達成電性測試與邏輯測試，為晶圓良率的把關者，可以減少不良品的封裝成本，而在封裝後，還會透過IC測試板做出貨前的檢驗，以確保產品良率，避免後續衍生客訴之成本。
IC載板為因應半導體之發展，技術需要不斷突破，IC載板在製程上更趨複雜，以便能檢測線寬愈來愈微縮的半導體晶片，對於資本密集產業的營運管理，設備成本乃是相當重要的資本，更搭上工業4.0的趨勢，各個產業皆在推行設備自動化與智慧製造，但IC載板所屬之印刷電路板產業卻躊躇不前，許多廠房仍舊為半自動化甚至手動作業，設備資訊無法完整擷取，導致設備管理成效不佳，產能因此下降而影響公司營收。
本研究以台灣IC載板公司為研究案例，分析其產業特性，導入全面生產管理之概念，主要透過綜合設備效率(Overall Equipment Efficiency, OEE)作為設備績效的管理指標，本研究應用「工業3.5」製造策略，藉由物聯網裝置擷取設備作動資訊，並以支持向量機將有效運作時間區分出來，以估計設備的有效稼動，協助後續管理應用。本研究考量IC載板之產業特性，並以SEMI對OEE的定義作為基礎，提供導入OEE於IC載板產業的管理方針。

Facing with the hyper-competitive semiconductor market, every enterprises pursue cost control and yield improvement to maintain competition advantages. In the semiconductor processes, IC substrate plays an important role. Before the wafer is packaged, it is conducted electrical test and digital test by wafer probe card. Probe card is the gatekeeper of bad yield. It can reduce the cost of packaging bad chips. After the wafer was packaged, it will be conducted final test by load board PCB prior to delivery. To ensure product yield and to avoid the cost of follow-up customer complaints.
In response to the development of semiconductor, the technology of IC substrate must be improved continually. The process of IC substrate become complex, so as to be able to detect more and more narrow linewidth of chips. For capital-intensive industries, the cost of equipment is a very important capital. With the trend of industry 4.0, all industries are in the implementation of equipment automation and intelligent manufacturing. However the printed circuit board(PCB) industry include IC substrate has hesitated. Many factories are still semi-automatic or even manual. Equipment information can not be fully acquired, resulting in poor performance of equipment management. Thus poor throughput affect the company's revenue.
Focusing on real study of an Taiwan’s manufacturer of IC substrate, this study aims to analyze industrial characteristics of IC substrade, and introduce the concept of Total Productive Management(TPM). The proposed approach employ Overall Equipment Efficiency(OEE) as an indicator of equipment performance. Following hybrid Manufacturing stragy of Industry 3.5, Internet of Things devices are used to acquire equipment information. Support vector machine is provided for distinguishing difference equipment statuses. It is able to calculate the effective availability, so that we can apply this approach to management. This study considers the industrial characteristics of IC substrate. Based on definition of OEE from SEMI, this study provided an management approach to IC substrate industry.

目錄 i
表目錄 iii
圖目錄 iv
第一章 緒論 1
1.1 研究背景、動機與重要性 1
1.2 研究目的 4
1.3 論文結構 5
第二章 文獻回顧 6
2.1 晶圓探針卡 6
2.2 全面生產管理 7
2.3 支持向量機 12
2.4 工業3.5 15
第三章 研究架構 19
3.1 研究步驟與架構圖 19
3.2 問題定義 20
3.3 資料準備 21
3.4 設備作動辨識模型建構 22
3.5 決策者管理應用 24
第四章 實證研究 28
4.1 實證研究之背景與問題定義 28
4.2 資料準備 29
4.3 設備作動辨識模型建構 31
4.4 模型修正與檢驗 35
第五章 結論與後續研究方向 37
5.1 研究結論 37
5.2 後續研究方向 37
參考文獻 39

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