近幾年AI及雲端的運算設備的效能不斷提升，散熱模組需求迎來龐大的市場商機，因為熱管理直接影響設備整體的可靠度。台灣在熱管及均溫板等散熱產品，不論是研發或生產技術都非常有競爭力。但散熱模組廠對於均溫板的產品，有各自不同的性能驗證方式，導致各廠商量測結果不是以同一基準判定產品好壞。所以本文深入探討均溫板各項量測參數，對於性能驗證結果的影響。
本研究以Angstrom Theory理論為基礎，搭配Flotherm模擬軟體之暫態分析功能，設計材料熱傳導係數的量測平台。包含動態溫控及數據擷取之專用程式，量測過程中，軟體可以自動擷取重要的關鍵參數，減少人為調整的誤差。熱傳導量測設備開發完成後，本文實測其重複性及精準度，針對電子散熱常見的金屬材料進行驗證，並分析一維及二維等不同尺寸的熱傳導數據。
本文針對厚均溫板、薄均溫板兩種不同的量測平台，依照其應用情境進行研究。以傅立葉熱傳理論為基礎，開發軸向及徑向的熱傳導性能驗證設備。蒸發段的加熱模組，本文提出以最小平方法(Least square)的數學模型計算TJS，這樣可以降低均溫板與銅塊接觸不良，提高軸向熱阻值量測準確性。冷凝段則是以水冷套件做為移熱機制，使用五種不同治具實測，分析量測數據，以減少逕向熱阻值量測誤差。薄均溫板的性能測試，本研究開發TGP兩點溫差的實驗架構。分析不同熱密度的測試情況，找出更能分辨薄型材料的熱擴散能力的設計。
本文完整的呈現理論分析與實驗架設的細節，期望可以幫助產業界對均溫板之量測標準更邁進一大步。
關鍵字：均溫板、熱傳導係數、熱阻、最小平方法

Continual advancements in the efficiency of artificial intelligence technology and cloud computing equipment have greatly increased the market demand for thermal modules, which directly affect the overall reliability of electronic equipment. Taiwan has considerable competitive advantages in technology for developing and manufacturing various thermal module components, including heat pipes and vapor chambers. However, thermal module manufacturers implement different methods for verifying the performance of their vapor chamber products, leading to inconsistency in measurement standards used for determining product quality. Given this situation, this study explored the various measurement parameters of vapor chambers to examine their effects on performance evaluation results.
Based on the Angstrom Theory, this study applied the transient state analysis function of the Flotherm simulation software to design a platform for measuring the thermal conductivity of product materials. The platform features designated programs for dynamic temperature control and data acquisition. During measurement, the platform software automatically acquires essential parameters to minimize errors due to manual adjustment. The repeatability and accuracy of the designed platform were tested with common metal materials used in thermal modules. In addition, the platform was used to analyze one-dimensional and two-dimensional thermal conductivity data obtained from components of varying sizes.
Two types of thermal modules were tested, namely thick vapor chamber and thin vapor chamber, according to their application scenarios. Based on Fourier’s law, measurement equipment was developed to verify the performance of the thermal module in axial and radial thermal resistance. The TJS of the evaporator section was calculated using the least square method to mitigate measurement error due to inadequate contact between the vapor chamber and copper block, thereby improving the measurement accuracy of axial thermal resistance. The condensation section featured a water-cooling module for heat removal, and 5 different cold plate were analyzed to reduce measurement errors pertaining to radial thermal resistance. To test thin vapor chambers, this study developed an experimental framework that measures the temperature difference between two points on a thermal ground plan. Analysis of test results obtained from different thermal densities yielded further insights into the thermal diffusion performance of thin vapor chambers using varying materials, thereby optimizing the design of measuring equipment.
The experimental configuration and theoretical analysis results of this study may serve as reference for enhancing industrial standards for measuring vapor chamber performance.

Keyword：Vapor chamber, Thermal conductivity, Thermal resistance, Least square

目錄
摘要 I
Abstract II
致謝 IV
目錄 V
圖目錄 VII
表目錄 XIII
符號表 XVI

第一章 緒論 1
1.1前言 1
1.2研究動機 3
1.3文獻回顧 4
第二章 理論基礎 17
2.1均溫板運作原理 17
2.2傅立葉熱傳理論 20
2.3以Angstrom Theory 量測有效徑向熱擴散傳導係數KSP 26
2.3.1一維Angstrom 理論推導熱傳導之統御方程式 27
2.3.2 Angstrom 理論於熱源正弦波溫度推導出之熱擴散傳導係數KSP 30
2.3.3自然對流下環境溫度對熱擴散傳導係數KSP之影響 34
2.3.4 Angstrom熱擴散率二維量測理論 35
2.4 以Flotherm模擬軟體驗證Angstrom Theory實驗平台 40
第三章 實驗流程與架構 43
3.1一維均質材料 43
3.1.1一維均質材料熱擴散實驗流程與架構 43
3.1.2一維均質材料量測模組設計與模擬分析 47
3.2厚均溫板實驗架構 49
3.3薄均溫板實驗架構 59
第四章 實驗結果與討論 66
4.1一維均質材料 66
4.1.1 一維均質材料實驗結果 66
4.1.2一維均質材料模擬結果 68
4.1.3二維均質材料實驗結果 72
4.2厚均溫板實驗結果 95
4.2.1不同冷卻水套結構對厚均溫板性能測試之影響 95
4.2.2最小平方法(Least square)導入均溫板性能測試實驗結果 97
4.2.3厚均溫板性水平與垂直架設之性能測試結果 101
4.3薄均溫板實驗結果 104
4.3.1最小平方法(Least square)計算加熱銅柱表面溫度TJS,cal與驗證 104
4.3.2 TGP均溫板兩點溫差在5mm與10mm點熱源之差異性 110
第五章 結論 119
參考文獻 121

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